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  1. Syagrus Systems LLC - Automated Wafer Backgrind, Automated Wafer Dicing, Automated and Manual Die Visual Inspection, Automated and Manual Die Sort

    Syagrus Systems LLC provides wafer grinding, dicing, inspection, and packaging services to the semiconductor insdustry
    packaging3
    silicon wafer1
    dicing1
    wafer processing1
    carrier tape1
    wafer handling1
    wafer dicing1
    wafer slicing1
    wafer fab1
    wafer fabrication1
    wafer bumping1
    semiconductor wafer1
    dry packaging1
    wafer probe1
    wafer prober1
    wafer test1
    die sort1
    wafer cutting1
    wafer backgrinding1
    thin wafer1
    semiconductor wafer processing1
    wafer sawing1
    wafer dicing tape1
    bare die processing0
    bumped die processing0
    bumped wafer processing0
    bump wafer inspection0
    component bake0
    dicing technology0
    die visual inspection0
    polishing single wafer0

    www.syagrussystems.com - 2009-02-08

  2. PRECISION GLASS WERKS

    Custom glass fabrication, Semiconductor, Motion Control, Encoders, Reticles, Photomasks, Wire Bonding, CNC machining, glass scribing, Laser cutting, micro ...
    imaging2
    coating2
    optical2
    micro2
    nano2
    Semiconductor2
    projection2
    Motion Control2
    Encoders1
    lithography1
    mems1
    grating1
    glass cutting1
    wire bonding1
    photoresist1
    photomask1
    grayscale1
    Reticles1
    photomasks1
    glass fabrication1
    wafer dicing1
    apertures1
    X-ray services1
    microelectronic packaging1
    chrome on glass1
    Custom glass fabrication1
    wafer sawing1
    laser pattern generation1
    pick and plate0
    Precision Glass Works0

    www.pgwerks.com - 2009-02-04

  3. CHIPS-INC, Custom wafer to die processing

    CHIPS-Inc.wafer to die processing for the semi-conductor industry. Mil I 45208A compliant Class10000 certified clean rooms,Class1 ESD NARTE Certified.
    commercial5
    industrial4
    Inspection3
    ceramic3
    grinding2
    Chips2
    sapphire2
    silicon2
    diodes1
    cmos1
    integrated circuits1
    thinning1
    transistors1
    wafers1
    arrays1
    Pick and place1
    glass cutting1
    dicing1
    Gallium Arsenide1
    semi conductor1
    wafer saw1
    wafer sawing1
    bumped die1
    IC’s1
    die processing tape reel0
    die sawing0
    Ga As mimics0
    ink less0
    Map decoding0
    map picking0
    wafer back lapping0

    www.chips-inc.com - 2009-02-04

map decoding0 cutting2 glass cutting1 ink less0 metal cutting tool1 dicing1 integrated circuits1 ceramic3 micro2 glass3 inspection3

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